Encapsulation Process

01

Wafer Back Grinding and Wafer Mount

Process Effect

Grinding the wafer backside by wheel to achieve the required thickness

Production Capacity

· 8 inch,12 inch wafer processing capability
· Wafer grinding thickness can reach 30um
· Wafer grinding thickness error range ±5um

02

Laser Grooving

Process Effect

Wafer chipping is reduced by cutting the metal layer on the wafer surface by laser burning at high temperature

Production Capacity

· Laser grooving width range 5-~35um
· Laser grooving thickness range 15~20um

03

Dicing

Process Effect

Using a blade to cut the wafer in sequence

Production Capacity

· The minimum cutting width can reach 40um

04

Die bonding

Process Effect

Die is attached to the substrate and secured by DAF

Production Capacity

· Die bonding precision ±5um
· Double bond head improve efficiency
· Bonding die thickness of 30um, be able to stack 16 Die

05

Wire Bonding

Process Effect

The pad of the die is connected to the finger ofthe substrate by gold wireor alloy wire

Production Capacity

· Minimum 0.6mil diameter gold wire
· Automatic focus, can work on multiple layers of products

06

Molding

Process Effect

Die and wire is sealed with compound, protect die and wire from damage,contamination and oxidation

Production Capacity

· High precision equipment can produce 2-16 layers stacking
· It can reduce the rupture of ultra-thin chips, ensure the stabilityof the product quality.

07

Marking

Process Effect

The brand name and product information are marked onto the surface of the product by laser

Production Capacity

· Depth error range ±3um
· One click to switch the product type

08

Ball Mount

Process Effect

Solder ball bond onto the pad of the substrate

Production Capacity

· Minimum diameter of solder ball 0.25mm
· Minimum spacing between solder balls

09

Package Saw

Process Effect

Using a blade to separate the die from the substrate

Production Capacity

· Sawing width 0.2~0.3mm
· Sawing error range ±3um

10

Ball Scan

Process Effect

The appearance of the product is tested through an optical lens, atthe same time, the equipment distinguishes the appearance type

Production Capacity

· Solder ball appearance check
· Marking content check

11

BGA DM

Process Effect

Die and wire is sealed with compound, protect die and wire from damage,contamination and oxidation

Production Capacity

· Automatic machine with vacuum system
· Automatic focus, can work on multiple layers of products

Test Standards

Functionality Testing

Basic Performance Test

Performance Test

IOPS Test

Latency Test

Customer Scenario Simulation Test

Raid Test

Reliability Testing

HAST    HTOL    LTOL

TC    ELFT    EDR

Read Interference Test

Data Retention Test

Lifetime Test

Compatibility Testing

Compatibility test for different chipsets

compatibility test for different systems such as Window/Linux/Android and different versions

ATE Electrical Testing

OS/Leakage Test

Static/Dynamic Power Consumption Test

AC Parameter Test

DC Parameter Test

Protocol Compatibility Testing

Reference to JEDEC corresponding specification and corresponding protocol specification for complete protocol testing

SV Testing

SI signal integrity test

PI power integrity test

Stability Testing

Stress test    Power-down test

Hot-swap test    Drop test

Upper and lower storage temperature limit test

Temperature bias quadrangle test

Temperature cycling test    Temperature shock test

Operating temperature test    High and low temperature read/write test,

Vibration test    Shock test