Encapsulation Process

STEP 1

Wafer Dicing

Cutting wafers into individual
chips along scribed lines with a
scribing machine

STEP 2

Die Attach

Move cut chips to leadframes
or PCBs

STEP 3

Bonding

Connect the soldered area
of the chip to the soldered area of
the substrate with a gold
wire using a gold
wire ball soldering machine

STEP 4

Laminated

The bonded semi-finished
product is encapsulated with plastic
sealing resin to protect the chip
and pads from contamination
and damage

STEP 5

Muscle Cutting

Cut off the DamBar area on
the frame and separate the
pins in preparation
for testing

STEP 6

Marking

Mark the finished circuit

STEP 7

Ball Mount

A solder ball is implanted
at the pin location of a
package substrate that
has been pre-coated with flux

STEP 8

Saw Singulation

Separate the product from the
framework

Test Standards

Functionality Testing

Basic Performance Test

Performance Test

IOPS Test

Latency Test

Customer Scenario Simulation Test

Raid Test

Reliability Testing

HAST    HTOL    LTOL

TC    ELFT    EDR

Read Interference Test

Data Retention Test

Lifetime Test

Compatibility Testing

Compatibility test for different chipsets

compatibility test for different systems such as Window/Linux/Android and different versions

ATE Electrical Testing

OS/Leakage Test

Static/Dynamic Power Consumption Test

AC Parameter Test

DC Parameter Test

Protocol Compatibility Testing

Reference to JEDEC corresponding specification and corresponding protocol specification for complete protocol testing

SV Testing

SI signal integrity test

PI power integrity test

Stability Testing

Stress test    Power-down test

Hot-swap test    Drop test

Upper and lower storage temperature limit test

Temperature bias quadrangle test

Temperature cycling test    Temperature shock test

Operating temperature test    High and low temperature read/write test,

Vibration test    Shock test